IEEE Computer Architecture Letters is a rigorously peer-reviewed forum for publishing early, high-impact results in the areas of uni- and multiprocessor computer systems, computer architecture, microarchitecture, workload characterization, performance evaluation and simulation techniques, and power-aware computing. Submissions are welcomed on any topic in computer architecture, especially but not limited to: microprocessor and multiprocessor systems, microarchitecture and ILP processors, workload characterization, performance evaluation and simulation techniques, compiler-hardware and operating system-hardware interactions, interconnect architectures, memory and cache systems, power and thermal issues at the architecture level, I/O architectures and techniques, independent validation of previously published results, analysis of unsuccessful techniques, domain-specific processor architectures (e.g., embedded, graphics, network, etc.), real-time and high-availability architectures, reconfigurable systems.LCA is a semi-annual forum for fast publication of new, high-quality ideas in the form of short, critically refereed, technical papers. Submissions are accepted on a continuing basis, and accepted letters will be published immediately in the IEEE Digital Library and in the next available print issue. Members of the Technical Committee on Computer Architecture will receive the print issue as a benefit of being a member. Authors should submit their manuscript through ScholarOne Manuscripts.
IEEE計算機體系結(jié)構是一個嚴格經(jīng)過同行評審的論壇,用于發(fā)布在單處理器和多處理器計算機系統(tǒng)、計算機體系結(jié)構、微體系結(jié)構、工作負載特性、性能評估和仿真技術以及功耗感知計算等領域的早期、高影響的結(jié)果。歡迎提交任何有關電腦架構的專題,特別是但不限于:微處理器和多處理器系統(tǒng)、微體系結(jié)構和ILP處理器、工作負載特性、性能評估和仿真技術、編譯器-硬件和操作系統(tǒng)-硬件交互、互連體系結(jié)構、內(nèi)存和緩存系統(tǒng)、體系結(jié)構級別的電源和熱問題、I/O體系結(jié)構和技術、對以前發(fā)布的結(jié)果的獨立驗證、不成功技術的分析、特定于領域的處理器體系結(jié)構(例如,嵌入式、圖形、網(wǎng)絡等)、實時和高可用性體系結(jié)構、可重構系統(tǒng)。LCA是一個半年度論壇,以簡短的、批判性參考的技術論文的形式快速發(fā)布新的、高質(zhì)量的想法。我們將繼續(xù)接受投稿,并將立即在IEEE數(shù)字圖書館和下一期印刷版上發(fā)表已被接受的信件。計算機體系結(jié)構技術委員會的成員將因成為成員而受益于印刷版。作者應通過學術論文投稿。
大類學科 | 分區(qū) | 小類學科 | 分區(qū) | Top期刊 | 綜述期刊 |
計算機科學 | 3區(qū) | COMPUTER SCIENCE, HARDWARE & ARCHITECTURE 計算機:硬件 | 3區(qū) | 否 | 否 |
JCR分區(qū)等級 | JCR所屬學科 | 分區(qū) | 影響因子 |
Q3 | COMPUTER SCIENCE, HARDWARE & ARCHITECTURE | Q3 | 2.118 |
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